Assigned to NORTHROP GRUMMAN CORPORATION reassignment NORTHROP GRUMMAN CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YANG, I-CHING T., NGUYEN, HUNG C.

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Application filed by Northrop Grumman Corp filed Critical Northrop Grumman Corp Priority to US10/284,707 priority Critical patent/US6828217B2/en Assigned to TRW INC. Original Assignee Northrop Grumman Corp Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) Yang Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Expired - Fee Related Application number US10/284,707 Other versions US20040084755A1

Google Patents Dicing process for GAAS/INP and other semiconductor materialsĭownload PDF Info Publication number US6828217B2 US6828217B2 US10/284,707 US28470702A US6828217B2 US 6828217 B2 US6828217 B2 US 6828217B2 US 28470702 A US28470702 A US 28470702A US 6828217 B2 US6828217 B2 US 6828217B2 Authority US United States Prior art keywords wafer lanes photoresist layer grooves dicing Prior art date Legal status (The legal status is an assumption and is not a legal conclusion.

Google Patents US6828217B2 - Dicing process for GAAS/INP and other semiconductor materials US6828217B2 - Dicing process for GAAS/INP and other semiconductor materials

Dicing saw chipping